Published on 04/08/2022




Job Description:

• Responsible for new platform socket product development reporting to Socket Platform Development team manager in Japan directly
• Work closely with internal teams (Sales, Product Manager (PM), System Architecture, Manufacturing Process Development Engineer (MPDE)) to create best competitive new platform design
• Often communicate with customers directly to get the detailed product requirements or to provide the key engineering information directly. The customers may be in China, US or other countries
• Generate new platform product concept based on the technology requirements which are provided from technology roadmap, customer inputs, manufacturing constraints and the cost target. The product often requires the adaptation of new product technology, process technology, and/or materials
• Execute new product and technology development project following TE new product development (new development process with stage gates) process by creating the deliverables (Design Concept, Simulation, PRD, DFMEA, etc.)
• Provide concept / design and feasibility study, design review meeting, well documentation, drawing / spec / necessary engineering documents release and archive.
• Lead in resolving the technical issues down to the closure and manage design & engineering changes.
• Hands-on try-out for getting feasible technical proposal, problem/issues solving, new solutions. Demonstrate TE solution with simulation, solid samples and/or professional engineering reports
• Judging manufacturing deviations and make decisions on deviation acceptance.
• Work with First Article Inspection (FAI) approvals, Process Capability Study, 8D report and 5 WHY analysis.
• Periodical engineering review and report
• B.S. degree or above, majored in mechanical engineering or related field.
• Working experience of connectors design with new product concept creation and installation. Socket related working experience is most preferred. The product concept creation experiences in consumer miniature connectors such as SIM/SD card, fine pitch board to board, highspeed I/O connectors are also preferred
• Extensive knowledge about molding, stamping, plating and auto assembly processes. The manufacturing process knowledge associated to miniature sized products will be a plus
• Abundant knowledge in material usage, industry standard, and international application
• Understand relevant knowledge about product reliability test, including mechanical, electrical and environmental test
• Proficient to use Creo or equivalent 3D CAD tool with solid working experience
• FEA simulation skill. Experience in ANSYS Mechanical is a plus.
• GD&T understanding and Tolerance analysis skill with statistical risk evaluation capability
• Knowledge in basic quality engineering such as Gauge R&R, SPC, QC Flow
• Good communication skill in English (oral and written) in order to correctly understand customer requirements and conveying engineering information in the teams. Proficiency in Japanese is a plus
• Good presentation skills with usage of PowerPoint (PPT) presentations.
• Mastery of office software such as Excel, PPT, etc.
• Effective problem-solving skills, willingness/ability to deal complex technical issues
Ability to work independently but collaboratively. Be clear with priorities by communications and execute the tasks accordingly

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